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This is the free Material Data Center Datasheet of KELON A FR H2 CETG/300-V0 - PA66-(GF+MX) - LATI Industria Termoplastici S.p.A.

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Processing/Physical Characteristics - 기계적 특성 - 열적 특성 - 전기적 특성 - 기타 특성 - Processing Recommendation Injection Molding
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Processing/Physical Characteristics값단위시험규격
ISO 데이터
성형 수축률, 평행 0.6 % ISO 294-4, 2577
성형 수축률, 수직 0.7 % ISO 294-4, 2577
기계적 특성값단위시험규격
ISO 데이터
인장탄성률 10000 MPa ISO 527
파단시 강도 80 MPa ISO 527
파단시 신율 1.6 % ISO 527
챠피 충격 강도, +23°C 20 kJ/m² ISO 179/1eU
챠피 노치드 충격 강도, +23°C 2 kJ/m² ISO 179/1eA
열적 특성값단위시험규격
ISO 데이터
하중하에서의 변형온도, 1.80 MPa 220 °C ISO 75-1/-2
하중하에서의 변형온도, 0.45 MPa 240 °C ISO 75-1/-2
비카트 연화 온도, B 235 °C ISO 306
선형 열팽창 계수, 평행 30 E-6/K ISO 11359-1/-2
Glow Wire Flammability Index (GWFI) 960 °C IEC 60695-2-12
GWFI - thickness tested (1) 1 mm -
Glow Wire Flammability Index (GWFI) 960 °C IEC 60695-2-12
GWFI - thickness tested (2) 2 mm -
Glow Wire Ignition Temperature (GWIT) 850 °C IEC 60695-2-13
GWIT - thickness tested (1) 1 mm -
Glow Wire Ignition Temperature (GWIT) 775 °C IEC 60695-2-13
GWIT - thickness tested (2) 2 mm -
ASTM 데이터
UL94 난연성 V-0 - UL 94
테스트 두께 0.75 mm -
산소지수 36 % ASTM D 2863
전기적 특성값단위시험규격
ISO 데이터
CTI 400 - IEC 60112
ASTM 데이터
표면 저항 1E12 Ohm ASTM D 257
기타 특성값단위시험규격
밀도 1610 kg/m³ ISO 1183
Processing Recommendation Injection Molding값단위시험규격
Pre-drying - Temperature 90 - 100 °C -
Pre-drying - Time 3 h -
용융수지온도 270 - 290 °C -
성형온도 70 - 100 °C -
특징
생산 공정
사출 성형
부가물
난연제
특별 특성
열안정성
지역별 검색
짱쨌쨈
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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